Near-EUV Modular Chip Fabrication Concept

1.半導體技術的快速發展需要創新方法來平衡製造成本、良率和性能。本提案提出了一種混合製造方法,將基於近極紫外光的微結構蝕刻與類似拼圖的模組化堆疊相結合,旨在提供高良率的晶片原型設計和靈活的設計可擴展性。 2. There is an opportunity to apply for a patent and welcome to use the evaluation The semiconductor industry is facing increasing challenges in cost, yield,and scalability. Extreme ultraviolet (EUV) lithography enables advancednodes but remains expensive and yield-sensitive. To address these issues,this proposal introduces a hybrid approach combining:1. Near-EUV microstructure fabrication for cost-effective unit creation.2. Puzzle-like modular stacking for scalable chip assembly.3. Misaligned stacking interconnection (“transfer docking”) for yieldtolerance.4. Sand-art style local repair for defect patching and material restoration.