94‐6: Low‐Thermal‐Stress TGV Leadless Wafer‐Level‐Package for MEMS High‐Temperature Pressure Sensors

Due to high insulation, low cost and low thermal stress of glass wafer, glass is considered as a promising material for advanced package in MEMS sensor. In this paper, a low‐thermal‐stress Silicon on insulator high temperature pressure sensor was developed by using TGV interconnect technology and glass‐based wafer‐level packaging technology.