A Scalable 1L2D Multi-Core Near-DRAM Computing Accelerator Based on 3D Hybrid Bonding for AI Models

Many memory-bound AI applications, including natural language processing, transformer-based visual recognition, and multi-task online inference, rely heavily on large-scale general matrix-vector multiplication (GEMV), which is characterized by strong data locality. However, existing hardware architectures for AI model inference face significant data transfer overheads and fail to fully exploit the data locality inherent in these algorithms. We propose a scalable one-logic-two-DRAM (1L2D) multi-core near-DRAM computing accelerator based on 3D hybrid bonding for AI models. Our 3D integration of RISC-V processors with vector accelerators and DRAM presents a unique approach that significantly boosts bandwidth while reducing energy consumption. A memory access circuit supporting page hit mechanism and prefetching strategy is designed to maximize the utilization of the data locality achieved by the algorithm's partitioning and rearranging of data. An interleaving memory address mapping scheme is designed to effectively enhance the bank-level parallelism of data access. Compared with the high-performance Intel Xeon-6230 CPU and the state-of-the-art commercially available UPMEM-PIM, the proposed architecture's computational efficiency for large-scale GEMV is improved by 3.4× and 2.2×, respectively. The architecture achieves a 3.07× improvement in bandwidth and a 76% reduction in energy consumption over the HBM2-PIM.

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Publication Details

Journal
IEICE Transactions on Electronics
Published
2025-08-17
DOI
https://doi.org/10.1587/transele.2025ecp5020
Primary Topic
Geochemistry and Geologic Mapping
Type
article
Field-Weighted Citation Impact
0.00

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article

A Scalable 1L2D Multi-Core Near-DRAM Computing Accelerator Based on 3D Hybrid Bonding for AI Models

IEICE Transactions on Electronics
Geochemistry and Geologic Mapping
article

A Scalable 1L2D Multi-Core Near-DRAM Computing Accelerator Based on 3D Hybrid Bonding for AI Models

article en

Abstract

Many memory-bound AI applications, including natural language processing, transformer-based visual recognition, and multi-task online inference, rely heavily on large-scale general matrix-vector multiplication (GEMV), which is characterized by strong data locality. However, existing hardware architectures for AI model inference face significant data transfer overheads and fail to fully exploit the data locality inherent in these algorithms. We propose a scalable one-logic-two-DRAM (1L2D) multi-core near-DRAM computing accelerator based on 3D hybrid bonding for AI models. Our 3D integration of RISC-V processors with vector accelerators and DRAM presents a unique approach that significantly boosts bandwidth while reducing energy consumption. A memory access circuit supporting page hit mechanism and prefetching strategy is designed to maximize the utilization of the data locality achieved by the algorithm's partitioning and rearranging of data. An interleaving memory address mapping scheme is designed to effectively enhance the bank-level parallelism of data access. Compared with the high-performance Intel Xeon-6230 CPU and the state-of-the-art commercially available UPMEM-PIM, the proposed architecture's computational efficiency for large-scale GEMV is improved by 3.4× and 2.2×, respectively. The architecture achieves a 3.07× improvement in bandwidth and a 76% reduction in energy consumption over the HBM2-PIM.

IEICE Transactions on ElectronicsVol. E109.C(3)
University of Science and Technology of China (CN), Institute of Microelectronics (SG), Shanghai Zhangjiang Laboratory (CN), Institute of Microelectronics (CN), University of Chinese Academy of Sciences (CN)
National Natural Science Foundation of China, Chinese Academy of Sciences, Natural Science Foundation of Zhejiang Province
Affordable and clean energy
Openalex Percentile: Top 69%
Geochemistry and Geologic Mapping
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A Scalable 1L2D Multi-Core Near-DRAM Computing Accelerator Based on 3D Hybrid Bonding for AI Models · IEICE Transactions on Electronics (2025) | TGRS Research Map | TGRS