89‐2: Cutting‐Edge Laser Forming in High‐Precision Hole Fabrication for Thin Glass Applications

We demonstrate a novel laser forming technique for precise hole fabrication in thin glass substrates for camera holes on OLED displays. Using controlled heat gradients and stress dynamics, interior holes are generated within 0.5 seconds with sub‐5 μm average chipping and no heat‐affected zone. This high‐precision process enables scalable solutions for advanced applications, such as high‐resolution OLED displays, requiring small‐diameter holes in thin glass with minimal thermal and structural damage.