P‐81: A Novel‐Bin Mixing Transfer Technology Based on Die Bonding Equipment for Mini/MicroLED Display

Mini/Micro‐LED self‐emissive displays have garnered extensive attention due to their superior display performance and broad application prospects. However, one significant challenge faced by Mini/Micro‐LED displays is the issue of color blocks and stripes caused by the non‐uniformity in wavelength and luminance of LED chips[1]. Addressing this problem traditionally incurs high wafer mixing costs to sort wafers into bin slices, resulting in the decline of display product competitiveness. In this study, we develop an innovative bin‐mixing transfer technology based on die bonding equipment to solve this problem. By developing a random pick‐andplace algorithm, we successfully achieve the randomization of LED chips, thereby significantly enhancing the brightness, wavelength, and color uniformity of display modules. Compared to traditional technologies that mixing LED chips from LED wafers, this technique improves single‐bin wafer utilization from 50% to 90%, and reduces overall costs by approximately 24%, thus significantly enhancing the competitiveness of Mini/Micro‐LED products. This novel technology provides a new solution for the mass production of Mini/Micro‐LED display products.