94‐3: <i>Invited Paper:</i> Multilayer Glass Structure for Advancing Packaging and Substrate Technologies

The rising power demands of AI technologies highlight the need for energy‐efficient solutions. While efforts to maximize performance per watt have driven the development of high‐density chip integration, traditional organic substrates are reaching their mechanical and electrical limitations. As a groundbreaking solution, glass substrates have garnered increasing attention for their superior properties. However, challenges such as processing issues associated with Through‐Glass Via (TGV) manufacturing and susceptibility to breakage must be addressed to enable their practical application. This paper introduces a novel multilayer glass structure as a comprehensive solution by sharing these innovative concepts, exploring the technical challenges in glass substrate applications, and discussing their potential impact on advancing packaging and substrate technologies.