81‐3: <i>Invited Paper:</i> Large Scale Glass Substrate for High Performance Computing Application

As the industry moves toward High Performance Computing (HPC) for huge data transmission with low power consumption. The requirements for PKG structure have become more challenging. The major engineering requirements for HPC application are high‐density, high‐speed data transmission, low loss, precision manufacturing with low‐cost process. High pin count needs large area package with high mechanical stability and low warpage. This paper presents the demonstration of RDL interposer and Glass Core Substrate with large panel size format. In case of Glass core substrate process, three metalized processes were compared process capability, reliability and high‐speed transmission characteristics. Filled with Cu method is found out low resistance, high transmission rate and high‐power density. In the thermal stress simulation, the heat characteristics and thermal mechanical stress analysis for two types of via shapes, straight and X‐shape, were analyzed, which indicated that straight vias were advantageous for suppressing heat generation, while X‐shape was for mitigating thermal stress. The reliability test result obtains stable resistance data because of combination of double‐sided polymer dielectrics. The double‐sided polymer dielectrics owing stress buffer of glass and cupper CTE difference. The Filled with Cu method demonstrated with large panel size format max 510x515mm with 6layers build‐up.