61‐1: Laser‐Assisted Bonding for Micro‐LED Modules in Head‐Up Display Applications

The mass transfer process is a critical aspect of microLED technology, with the metal interconnect between the chip and substrate as a key bottleneck. Laser‐assisted eutectic bonding improved photoelectric efficiency by 51.3%, enabling the realization of a 3.8‐inch, 1280×1024 ultra‐high‐resolution HUD display module with a lighting yield exceeding 99.9%, accelerating Micro‐LED commercialization.