53‐3: Peelable Inkjet Protective Film Process Development for MicroLED

The research task of this paper is the development of an inkjet thin film process that protects the front and rear stacking layers during the 80 inch or larger Micro LED TV manufacturing process by the Tiling modulus of the IT size panel (cell). During the LTPS FAB manufacturing process, the inkjet protective film must be transparent for intermediate inspection and must have vacuum resistance (No Outgasing) / chemical resistance required for processes such as dry etching or wet etching to remove the sacrificial layer. In addition, it should be possible to form a patterning film that prints only the necessary area so that there is no interference in the process such as vacuum chuck, logistics roller, and glass cell cutting. In order to satisfy these requirements, we first built a multi‐head monomer inkjet and infrastructure as a stage‐compatible facility that can respond to original size and UV Insitu. By splitting the separation distance between the temporary curing unit and the inkjet head (temporary curing waiting time/tuning the overlapping part of the head), the adhesion precision and edge thickness distribution were improved. Through component (Binder/monomers/additives) tuning, it was confirmed that peeling force < 20gf/inch (thickness fixed at 100~150um) proceeded without tearing from initial peeling to main peeling. In addition, in order to secure resistance to FAB progress, the process was verified by reducing the amount of He flow during the dry etching process and adding additives to prevent peel off during the wet etching process. there was no the peel force distribution of the inkjet sample, which is currently developed for mass production, is ±10% gf/inch, which is superior to that of general films ±20%. However, the current modulus and elongation need to be further improved in order to lower the thickness to reduce inkjet chemical cost.