43‐1: <i>Invited Paper:</i> The Latest Trends on CMOS Backplane for µLEDoS Microdisplay for AR Smart Glasses

This paper explores emerging trends in the implementation of CMOS (Complementary Metal‐Oxide‐Semiconductor) backplane for µLEDoS (Micro‐LED on Silicon) microdisplays in future AR smart glasses. The design and performance of these backplanes are influenced by key factors such as Field of View (FOV), latency, motion blur compensation, form factor, power consumption, and manufacturability. An expanded FOV, which is crucial for an immersive user experience, necessitates higher display resolution, impacting power efficiency, die size, and overall system performance. Additionally, future AR smart glasses require advanced motion compensation techniques to mitigate image artifacts caused by head or eye movement. This paper introduces the design concept and operational principles of the Memory‐Inside‐Pixel (MIP) pixel architecture, with a particular focus on pixel‐level image operations aimed at minimizing motion blur and enhancing visual quality.