38‐4: <i>Distinguished Paper:</i> 0.26‐in. LED Microdisplay Using Pixel Level Cu‐Cu Connections of Transferred GaN/Si and CMOS Backplane Wafer

We developed an integration process for LED microdisplays and present the first demonstration of a blue‐color active‐matrix LED microdisplay fabricated with this process. This process consists of Cu‐Cu hybridization to connect heterogeneous materials; a dieto‐silicon transferred GaN/Si wafer and a CMOS backplane wafer, followed by LED mesas and on‐chip lenses fabrication. We report the key features and results of this process, and present a prototype of 0.26‐inch, 5644‐ppi LED microdisplay.