Finita-element-analys av värmeledning i en satellitdator

In this thesis, an FE model for heat transfer analysis of the of a satellite computer has been constructed. Comparisons have been made between the simulations and real world test data acquired by Thermal Vacuum Chamber Testing data of assembled computers. By deeming the simulation results acceptably accurate, the FE model was used to explore the cooling structure design space. A design replacing parts of the aluminium structure found in the original design with a simplified model of a so called copper strap together with novel thermal interfacing materials has been simulated. The simulations show that there are gains to be found in replacing the solid structure with better performing designs. In addition to trialing new designs, the parameter sensitivity of the FE model has been studied by varying certain heat transfer parameters showing that the contact resistance in the thermal interface material impacts the heat transfer performance in the simulation more than the other parameters studied. The findings in the simulation work have been condensed into best practices and guidelines for satellite computers of similar form factor as well as suggestions for future designs attempted by the company.