Production of SAW devices on LiNbO3 using bi-layer liftoff lithography

Surface acoustic wave (SAW) devices leverage properties of piezoelectric materials to excite mechanical waves, which can be used in applications such as radiofrequency filters, harmonic transponders, and acoustic signal processing. These devices use interdigitated transducers of alternating voltage polarity placed on top of the substrate with dimensions impacting the behavior of the completed device. This work aims to develop a standard process flow for efficient and accurate production of SAW devices using tooling present at UVM. The process flow will allow for production of devices to study In2 Se3 acoustoelectrics, and enable future research surrounding SAW devices at UVM.