СУЧАСНІ ТЕХНОЛОГІЇ ПОЛІРУВАННЯ КРИХКИХ ТА ПЛАСТИЧНИХ МАТЕРІАЛІВ (ОГЛЯД)

Modern technologies in machine and instrument building require new high-tech materials, the processing of which is much more complicated, especially from the point of view of achieving quality indicators of the final surface of the product. All this means that it is important to pay attention to finishing, namely polishing processes, to increase the efficiency of the machining process. The researches known from the literature testify specifically to the effectiveness of the application of chemical-mechanical methods in polishing, taking into account the peculiarities of the abrasives used, therefore the purpose of this article was to investigate the latest (2022—2023) developments in polishing technologies of a wide range of modern brittle and plastic materials and determine directions for improving the efficiency of such developments. Analysis of data on the method of chemical-mechanical polishing of products from different materials allowed us to establish that it is based on the synergistic action of a modified abrasive, mainly on the basis of CeO2, and the addition of chemical reactions using liquid suspensions or solid-phase chemical reactions, as well as on the development of new micro-grinding tools. An example of such a synergistic action is the new mechanical-mechanochemical synergistic technology of micro-grinding of fused silica and combined abrasive micro-grinding tools. First, grinding with diamond abrasives is carried out, and the next step is a solid-phase chemical reaction with a workpiece based on a mechanochemical reaction based on oxide abrasives (with additives) under the conditions of friction-thermal connection. That is, cerium oxide was used not only as grains to remove chemical reagents, but more importantly, as a reagent that directly participates in a solid-phase chemical reaction. It has been proven that, in general, the method of chemical-mechanical polishing with various modifications makes it possible to obtain, for materials of different hardness, almost the same, actually limiting at the lower level, indicators of surface roughness according to the Sa parameter: for fused silica 0.124 nm and for silicon 0.1 nm, and for soft copper — 0.1 nm.