Towards 200 mm 2D materials transfer: Wafer scale characterizations during 2D materials transfer onto temporary substrate.

Publication Details

Journal
SPIRE - Sciences Po Institutional REpository
Published
2024-12-01
Primary Topic
3D IC and TSV technologies
Type
article
Field-Weighted Citation Impact
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article

Towards 200 mm 2D materials transfer: Wafer scale characterizations during 2D materials transfer onto temporary substrate.

SPIRE - Sciences Po Institutional REpository
3D IC and TSV technologies
article

Towards 200 mm 2D materials transfer: Wafer scale characterizations during 2D materials transfer onto temporary substrate.

article en

Abstract

No abstract available for this paper.
SPIRE - Sciences Po Institutional REpository
Openalex Percentile: Top 63%
3D IC and TSV technologies
OpenAlex
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Towards 200 mm 2D materials transfer: Wafer scale characterizations during 2D materials transfer onto temporary substrate. · SPIRE - Sciences Po Institutional REpository (2024) | TGRS Research Map | TGRS