Integrity of power electronic components on a rotating PCB

This paper presents an initial study on the physical integrity of small power electronic components mounted on a rotating Printed Circuit Board (PCB) using solder-pin pairs. A practical approach, based on measured failure stress of the solder-pin pairs, is used to predict the rotational speeds – and corresponding inertial forces – at which components may lose their connection to the PCB. High-speed rotational tests of the PCB are conducted to validate the approach. Results indicate that the method provides conservative predictions for the failure of inertial loads of the components, ensuring a safety factor in practical applications.