Multiscale thermal and thermomechanical analysis of a SiP using Fan Out Wafer LevelPackaging (FO-WLP) technology

Publication Details

Journal
SPIRE - Sciences Po Institutional REpository
Published
2025-03-26
Primary Topic
3D IC and TSV technologies
Type
article
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article

Multiscale thermal and thermomechanical analysis of a SiP using Fan Out Wafer LevelPackaging (FO-WLP) technology

SPIRE - Sciences Po Institutional REpository
3D IC and TSV technologies
article

Multiscale thermal and thermomechanical analysis of a SiP using Fan Out Wafer LevelPackaging (FO-WLP) technology

article en

Abstract

No abstract available for this paper.
SPIRE - Sciences Po Institutional REpository
Industry, innovation and infrastructure
Openalex Percentile: Top 53%
3D IC and TSV technologies
OpenAlex
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Multiscale thermal and thermomechanical analysis of a SiP using Fan Out Wafer LevelPackaging (FO-WLP) technology · SPIRE - Sciences Po Institutional REpository (2025) | TGRS Research Map | TGRS