Improved Parameters of ANAND Model and Advanced FEA Technique for Low-Cycle Fatigue Life: Finite Element Analysis Models for Pb-free Solder and Pb Solder in Real Life Ball Gird Ally Package

The present study uses the finite element method to evaluate the fatigue life of solder joints of plastic ball grid array packages (PBGA) under thermal-cycling conditions. A Series of precise 3D FE models for solder joints of plastic ball grid array packages is created to improve reliability prediction accuracy. Damage parameters are obtained from the FEA results and used to estimate solder balls’ thermal fatigue life. The Coffin-Manson equation is employed. The predicted thermal fatigue lives are discussed in detail.\nDue to marketing and legislative pressures, Pb-free solder is fast becoming a reality in electronic manufacturing. The industry has concluded that various versions of SnAgCu solder alloy offer the best alternative for eutectic SnPb solder. With the current trend of cheaper, faster, and better electronic equipment, evaluating the package and system performance very early in the design cycle using simulation tools has become increasingly important. This requires life prediction models for new solder alloy systems to predict package-to-board interconnect reliability for various environmental and field conditions.\nThis paper introduces an FEA modeling technique that produces acceptable and reliable results in the fatigue life prediction of solder balls. Also, the fatigue life of two different Pb-free solders and two different traditional SnPb solders will be compared. It also describes the life prediction process of solder joints in a real-life package.\nThe approach in this study uses advanced finite element modeling and analysis techniques based on deformation mechanics. Both accumulated creep strain and creep Strain energy density-based models are developed.