Finite element model for the study and optimization of thin-film electro-adhesive devices

Thin-film electro-adhesive devices (TFEADs) are flexible electrostatic systems that can be used as clutches or as grippers for object catching and manipulation. Originally conceived with the main purpose of enhancing the locomotion of people and machines, TFEADs are currently receiving significant interest from the automated packaging industry and the space sector. The performances of TFEAD heavily depend on the electrodes' geometry and on the electrical properties of the materials of both the device and the grasped object. In this context, the poster describes a finite element model to simulate the electrical response of TFEAD and, specifically, to compute the adhesion force. Besides comparing it with other simulation models frequently used in the literature, results are presented to show its adoption to optimize the architecture of a TFEAD for specific grasped objects.