Laser Assisted Bonding for Flip Chip Interconnection of Very Large Chips

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Publication Details

Journal
SPIRE - Sciences Po Institutional REpository
Published
2024-09-30
Primary Topic
Pregnancy and preeclampsia studies
Type
article
Field-Weighted Citation Impact
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article

Laser Assisted Bonding for Flip Chip Interconnection of Very Large Chips

SPIRE - Sciences Po Institutional REpository
Pregnancy and preeclampsia studies
article

Laser Assisted Bonding for Flip Chip Interconnection of Very Large Chips

article en

Abstract

No abstract available for this paper.
SPIRE - Sciences Po Institutional REpository
Centre National de la Recherche Scientifique (FR), Université de Sherbrooke (CA)
Openalex Percentile: Top 42%
Pregnancy and preeclampsia studies
OpenAlex
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Laser Assisted Bonding for Flip Chip Interconnection of Very Large Chips · SPIRE - Sciences Po Institutional REpository (2024) | TGRS Research Map | TGRS