Geometric Programming for 3D Circuits

With the soaring demand for high-performing integrated circuits, 3D integrated circuits (ICs) have emerged as a promising alternative to traditional planar structures. Unlike existing 3D ICs that stack 2D layers, a full 3D IC features cubic circuit elements unrestricted by layers, offering greater design freedom. Design problems such as floorplanning, transistor sizing, and interconnect sizing are highly complex due to the 3D nature of the circuits and unavoidably require systematic approaches. We introduce geometric programming to solve these design optimization problems systematically and efficiently.

Publication Details

Journal
ArXiv.org
Published
2025-04-01
Primary Topic
3D IC and TSV technologies
Type
article
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article

Geometric Programming for 3D Circuits

ArXiv.org
3D IC and TSV technologies
article

Geometric Programming for 3D Circuits

article en

Abstract

With the soaring demand for high-performing integrated circuits, 3D integrated circuits (ICs) have emerged as a promising alternative to traditional planar structures. Unlike existing 3D ICs that stack 2D layers, a full 3D IC features cubic circuit elements unrestricted by layers, offering greater design freedom. Design problems such as floorplanning, transistor sizing, and interconnect sizing are highly complex due to the 3D nature of the circuits and unavoidably require systematic approaches. We introduce geometric programming to solve these design optimization problems systematically and efficiently.

ArXiv.org
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3D IC and TSV technologies
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Geometric Programming for 3D Circuits · ArXiv.org (2025) | TGRS Research Map | TGRS