ReWafer Mosaic IHS and PCB IHS – Concept Proposal

本方案提出了一種將半導體製造過程中廢棄的晶圓邊緣材料形成利用的創新方法。這些不規則的矽廢料經過修剪、填充,並排列成馬賽克結構,最終一個功能性的CPU阻塞(IHS-整合式底座)。重新穿透熱黏合劑和支撐底層,此阻塞在保持機械穩定性和流動性的同時,也增強了視覺衝擊力和生態永續性。 本節探討先進的材料路徑,利用回收的矽晶圓粉與玻璃纖維混合,形成多功能複合板。高科技矽與工業玻璃纖維的混合材料可用於裝飾面板、結構嵌件和EMI屏蔽組件,將ESG永續性與工程性能完美融合。 4.This proposal outlines an innovative approach to CPU thermal managementby replacing the traditional Integrated Heat Spreader (IHS) with a customdesigned stacked PCB top cover. The top cover is enhanced by incorporatingheat-dissipating material, such as graphite sheets or thermal pads, allowing itto function as both a structural cover and an effective thermal transfermedium.