Solder Pastes in Shingled Modules

In this work, we show that solder pastes can be used in the shingled module concept and exhibit excellent durability. We further explore the use of solder pastes for shingled module applications with particular attention focused on reducing the amount of solder paste required per interconnection, the compatibility with relevant industrial module assembly processes, extending the mechanical integrity of connections through the use of non-conductive adhesive, and on the performance and durability of shingled modules made using optimized application of this material.