Improving thermal management of SiC MOSFET through cold plates and/or power modules optimization

An experimental and numerical investigation on the impact of internal heat spreader and optimized cold plate for cooling SiC power module is presented. Silver-diamond (AgD) composites are used as heat spreaders under the SiC chips, while the cold plates are fitted with specific geometries to enhance convective heat transfers. This study is conducted for a flow regime varying from 500 < Reynolds < 8000. Thermal results show that the use of heat spreaders induces a 20% reduction of Rth(j-a). Similarly, an optimized cold plate design would reduce the cold plate thermal resistance by more than 55%. The study demonstrates that the heat spreader efficiency is better in the case of the use of an optimized design cold plate.