Sheet resistance of AlGaN/GaN heterostructures with barriers of increased Al content

In this work, a set of AlxGa1−xN/GaN heterostructures with increased aluminum mole fraction up to 0.30–0.45 was grown using metalorganic vapor-phase epitaxy on silicon substrates. It was shown that the dependence of sheet resistance on the aluminum mole fraction had a minimum at x ~ 0.37. The lowest experimentally obtained value was 236 Ω/sq., which, to the best of our knowledge, is the lowest reported value for AlGaN/GaN structures grown on Si substrates.

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Publication Details

Journal
St. Petersburg State Polytechnical University Journal
Published
2025-01-01
DOI
https://doi.org/10.18721/jpm.181.108
Primary Topic
GaN-based semiconductor devices and materials
Type
article
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article

Sheet resistance of AlGaN/GaN heterostructures with barriers of increased Al content

St. Petersburg State Polytechnical University Journal
GaN-based semiconductor devices and materials
article

Sheet resistance of AlGaN/GaN heterostructures with barriers of increased Al content

article en

Abstract

In this work, a set of AlxGa1−xN/GaN heterostructures with increased aluminum mole fraction up to 0.30–0.45 was grown using metalorganic vapor-phase epitaxy on silicon substrates. It was shown that the dependence of sheet resistance on the aluminum mole fraction had a minimum at x ~ 0.37. The lowest experimentally obtained value was 236 Ω/sq., which, to the best of our knowledge, is the lowest reported value for AlGaN/GaN structures grown on Si substrates.

St. Petersburg State Polytechnical University Journal
Submicron Heterostructures for Microelectronics Research and Engineering Center (RU), Ioffe Institute (RU)
Openalex Percentile: Top 68%
GaN-based semiconductor devices and materials
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