Sheet resistance of AlGaN/GaN heterostructures with barriers of increased Al content
In this work, a set of AlxGa1−xN/GaN heterostructures with increased aluminum mole fraction up to 0.30–0.45 was grown using metalorganic vapor-phase epitaxy on silicon substrates. It was shown that the dependence of sheet resistance on the aluminum mole fraction had a minimum at x ~ 0.37. The lowest experimentally obtained value was 236 Ω/sq., which, to the best of our knowledge, is the lowest reported value for AlGaN/GaN structures grown on Si substrates.
Institutions
- Submicron Heterostructures for Microelectronics Research and Engineering Center (RU)
- Ioffe Institute (RU)
Publication Details
- Journal
- St. Petersburg State Polytechnical University Journal
- Published
- 2025-01-01
- DOI
- https://doi.org/10.18721/jpm.181.108
- Primary Topic
- GaN-based semiconductor devices and materials
- Type
- article
- Field-Weighted Citation Impact
- 0.00