Construction of Sulfur Doped Nickel and Copper Interfaces\nfor Hydrogen Evolution Reaction

Developing\nefficient and economical electrocatalysts for the hydrogen\nevolution reaction (HER) is important for high-purity hydrogen generation.\nTransition metals-based compounds have been considered as promising\nsubstitutes for the Pt-based electrocatalysts toward HER. Nevertheless,\npure metals display inert HER activity because of their unfavorable\nadsorption behavior for intermediates. Herein, thiourea engaged electrodeposition\nwas conducted to fabricate sulfur-doped nickel and copper (S–Ni/Cu)\nnanowires that contain numerous interfaces. Interface and sulfur doping\nredistributed the electronic states of the electrocatalyst structure,\nwhich accelerated the adsorption of hydrogen atoms at active sites\nand promoted the water dissociation process. Consequently, the HER\noverpotential of S–Ni/Cu is only 67 mV at 10 mA cm<sup>–2</sup>, with excellent durability.