Twyman effect in laser polishing of fused silica wafers

\nThis paper investigates the challenges of minimizing wafer deformation during laser polishing of fused silica. The focus is on the Twyman effect, which causes unwanted curvature in thin plates. Strategies to reduce stress-induced deformation are proposed to enhance the reproducibility of the laser polishing process.\n

Publication Details

Journal
Springer Link (Chiba Institute of Technology)
Published
2024-10-31
DOI
https://doi.org/10.1051/epjconf/202430903026/pdf
Primary Topic
Genetic diversity and population structure
Type
article
Field-Weighted Citation Impact
0.00
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article

Twyman effect in laser polishing of fused silica wafers

Springer Link (Chiba Institute of Technology)
Genetic diversity and population structure
article

Twyman effect in laser polishing of fused silica wafers

article en

Abstract

\nThis paper investigates the challenges of minimizing wafer deformation during laser polishing of fused silica. The focus is on the Twyman effect, which causes unwanted curvature in thin plates. Strategies to reduce stress-induced deformation are proposed to enhance the reproducibility of the laser polishing process.\n

Springer Link (Chiba Institute of Technology)
Openalex Percentile: Top 48%
Genetic diversity and population structure
DOIOpen Access PDFOpenAlex
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Twyman effect in laser polishing of fused silica wafers · Springer Link (Chiba Institute of Technology) (2024) | TGRS Research Map | TGRS