Transferable\nPercolated Particle Monolayers Derived\nfrom Marangoni Flows for Thermally Conductive Dielectric Coatings

Thermal management\nis becoming one of the most significant design\nand size limitations for high power density electronics, including\nmotherboards, power converters, and phased array antennas for 5G communications.\nThere are few options for conducting heat away with dielectric materials\nthat avoid shortening or distorting the performance of these electronics.\nCertain highly thermally conductive 2D and 3D materials, including\nhexagonal boron nitride and diamond, offer ideal material properties\nto address these issues but are extremely challenging to process.\nThis work studies highly oriented single-particle thick films of hexagonal\nboron nitride, manufactured through a modified Langmuir–Blodgett\nprocess and densified further using the Marangoni effect to attain\nremarkable thermal conductivity enhancement with minimal coating thickness.\nHigh loadings of hexagonal boron nitride (∼60 vol %) in dense,\ncastable films are also produced to compare thermal spreading ability\nin a comparatively simpler but less-coordinated percolated system\nto the highly percolated particle monolayers. These procedures were\napplied to glass fiber reinforced polymers used in aerospace and radome\napplications as well as to a single-board computer to demonstrate\nenhanced thermal management.

Publication Details

Journal
Figshare
Published
2024-10-25
DOI
https://doi.org/10.1021/acsami.4c14039.s001
Primary Topic
African Botany and Ecology Studies
Type
article
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0.00
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article

Transferable\nPercolated Particle Monolayers Derived\nfrom Marangoni Flows for Thermally Conductive Dielectric Coatings

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African Botany and Ecology Studies
article

Transferable\nPercolated Particle Monolayers Derived\nfrom Marangoni Flows for Thermally Conductive Dielectric Coatings

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Abstract

Thermal management\nis becoming one of the most significant design\nand size limitations for high power density electronics, including\nmotherboards, power converters, and phased array antennas for 5G communications.\nThere are few options for conducting heat away with dielectric materials\nthat avoid shortening or distorting the performance of these electronics.\nCertain highly thermally conductive 2D and 3D materials, including\nhexagonal boron nitride and diamond, offer ideal material properties\nto address these issues but are extremely challenging to process.\nThis work studies highly oriented single-particle thick films of hexagonal\nboron nitride, manufactured through a modified Langmuir–Blodgett\nprocess and densified further using the Marangoni effect to attain\nremarkable thermal conductivity enhancement with minimal coating thickness.\nHigh loadings of hexagonal boron nitride (∼60 vol %) in dense,\ncastable films are also produced to compare thermal spreading ability\nin a comparatively simpler but less-coordinated percolated system\nto the highly percolated particle monolayers. These procedures were\napplied to glass fiber reinforced polymers used in aerospace and radome\napplications as well as to a single-board computer to demonstrate\nenhanced thermal management.

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