Gradient Corrosion-Resistant Copper Using Molecular\nDecomposable Ink from Recycling

Oxidation\nand corrosion present significant challenges for copper\nin critical applications such as electronics. Graphene-like carbon\nmaterials hold promise for preventing oxidation and corrosion, but\ntheir application to metallic surfaces is hindered by a complex immobilization\nprocess. Herein, we describe copper-based molecular decomposable inks\nderived from recycling which enable <i>in situ</i> conversion\nto form a coppergraphitic carbon hierarchical structure. This\nstructure withstands severe corrosive and oxidative environments and\nmaintains stable performance across a wide temperature range, from\ncryogenic (−193 °C) to high temperature (500 °C)\nconditions. The graphitic carbon shell acts as an effective barrier,\npreventing oxidation and corrosion by creating lengthy diffusion routes\nwithin the hierarchical copper matrix. This enables the reliable operation\nof a printed antenna under a corrosive environment in a reliable fashion.\nThe results show that the copper with a graphitic carbon shell has\nexcellent oxidation and corrosion resistance capabilities, and the\nfindings can be expanded to establish printed molecular decomposable\nmaterials as a platform for rapid prototyping of anticorrosion and\nantioxidation electronics suitable for different environmental conditions.