Enhancing the thermal conductivity of epoxy resin by incorporating 1-aminopyrene modified pitch-based carbon fiber via non-covalent bonding strategy

Epoxy resin (EP) is widely utilized in electronics and electrical engineering due to its excellent mechanical strength and electrical insulation properties. However, its inherently low thermal conductivity hampers effective heat dissipation, thereby compromising the performance and reliability of electronic components. In this study, pitch-based carbon fibers (CFs) were modified with 1-aminopyrene via π–π stacking interactions to enhance interfacial adhesion with epoxy matrix and reduce phonon scattering and were subsequently incorporated into the matrix to fabricate thermally conductive composites. Surface characterization using scanning electron microscopy (SEM), atomic force microscopy (AFM), Raman spectroscopy, and X-ray photoelectron spectroscopy (XPS) confirmed increased surface roughness and successful functionalization of the CFs. At a loading of 10 wt%, the thermal conductivity of the CFs-NH₂/EP composites came to 1.8 W/m·K, representing a 30.4% enhancement compared to the unmodified CFs/EP. Infrared thermography and differential scanning calorimetry (DSC) analyses further demonstrated improved heat dissipation and thermal resistance. Moreover, the composite retained favorable dielectric properties. This work presents a facile and effective non-covalent modification strategy for developing high thermal conductivity epoxy composites, offering significant potential in advanced electronic and electrical systems.