looking forward to ixxxx reference application

Gridcore is a modular computing architecture thatrestructures traditional CPU packaging by implementing a vertically integrateddesign consisting of a central processing die, an interconnect grid layer, and asubstrate interface module. This design simplifies manufacturing, enablesenhanced signal integrity, and offers scalable thermal and electricaloptimization for future CPU and GPU systems.

Publication Details

Journal
Zenodo (CERN European Organization for Nuclear Research)
Published
2025-07-25
DOI
https://doi.org/10.5281/zenodo.16416789
Primary Topic
3D IC and TSV technologies
Type
article
Field-Weighted Citation Impact
0.00
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looking forward to ixxxx reference application

Zenodo (CERN European Organization for Nuclear Research)
3D IC and TSV technologies
article

looking forward to ixxxx reference application

article en

Abstract

Gridcore is a modular computing architecture thatrestructures traditional CPU packaging by implementing a vertically integrateddesign consisting of a central processing die, an interconnect grid layer, and asubstrate interface module. This design simplifies manufacturing, enablesenhanced signal integrity, and offers scalable thermal and electricaloptimization for future CPU and GPU systems.

Zenodo (CERN European Organization for Nuclear Research)
Openalex Percentile: Top 55%
3D IC and TSV technologies
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looking forward to ixxxx reference application · Zenodo (CERN European Organization for Nuclear Research) (2025) | TGRS Research Map | TGRS