ZettaLith: WSSCB manufacturing process

Detailed manufacturing process for the wafer-scale silicon circuit board (WSSCB) used in ZettaLith and ExaLith

Institutions

Publication Details

Journal
Zenodo (CERN European Organization for Nuclear Research)
Published
2025-06-12
DOI
https://doi.org/10.5281/zenodo.15645985
Primary Topic
3D IC and TSV technologies
Type
article
Field-Weighted Citation Impact
0.00
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article

ZettaLith: WSSCB manufacturing process

Zenodo (CERN European Organization for Nuclear Research)
3D IC and TSV technologies
article

ZettaLith: WSSCB manufacturing process

article en

Abstract

Detailed manufacturing process for the wafer-scale silicon circuit board (WSSCB) used in ZettaLith and ExaLith

Zenodo (CERN European Organization for Nuclear Research)
Zen-Noh (Japan) (JP)
Industry, innovation and infrastructure
Openalex Percentile: Top 55%
3D IC and TSV technologies
DOIOpen Access PDFOpenAlex
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ZettaLith: WSSCB manufacturing process · Zenodo (CERN European Organization for Nuclear Research) (2025) | TGRS Research Map | TGRS