Test Beam Studies of Prototype Module and Test Measurements of MaPSA for the CMS Outer Tracker Phase-2 Upgrade

The High-Luminosity Large Hadron Collider (HL-LHC) represents a significant leap inthe pursuit of fundamental physics. Scheduled to operate at a center-of-mass energy of14 TeV and a peak instantaneous luminosity up to 7. 5 ◊ 1034 cm≠2 s ≠1 , it aims to deliverup to 3000 fb ≠1 of integrated luminosity by the late 2030s. To meet the unprecedentedchallenges of the HL-LHC environment, the Compact Muon Solenoid (CMS) experimentis undergoing comprehensive upgrades. The silicon tracker will be completely replacedwith a more robust design to withstand higher radiation doses and handle significantlyincreased data rates. The Outer Tracker introduces an innovative p T -module concept thatenables transverse momentum discrimination by correlating hits from closely spaced siliconsensors. This functionality reduces the data volume processed by the Level-1 trigger byfiltering low- p T candidates, ensuring that only high- p T tracks, which are more relevant forphysics analysis, contribute to the Level-1 trigger decision.This thesis presents contributions to key aspects of the Outer Tracker upgrade, includingboth 2S and PS module development. The first part focuses on the assembly andcharacterization of prototype 2S modules, with a sensor thickness of 240 μm. The 2Sprototype module demonstrated excellent performance, as validated through electrical andbeam tests conducted at DESY, achieving a particle detection eciency above 99. 9% anda stub detection eciency exceeding 99.7%. Beam tests also confirmed the design conceptfor discriminating low transverse momentum tracks, showing agreement with expectations.The second part focuses on the development of a test stand for the quality assurance of theMacro Pixel Sub-Assembly (MaPSA), a main component of the PS module. Establishedto support the production of over 1250 PS modules at DESY, the test stand facilitatesthe testing and grading of MaPSAs. A comprehensive electrical testing workflow wasimplemented, including current measurements, pixel functionality tests, bump bondingevaluations, and threshold equalization. The threshold equalization procedure was opti-mized to achieve precise alignment of pixel responses, minimizing the risk of misclassifyinguntrimmable pixels. Through successful evaluations of prototype MaPSAs, the test standhas demonstrated its reliability and readiness for the production phase.