Localized Embedded Passive Module Layer for High-Performance PCB and Package Designs

This proposal introduces a Localized Embedded Passive ModuleLayer (LEPML) concept, integrating capacitors, resistors, andoptionally inductors directly into targeted zones of a PCB or packagesubstrate.

Publication Details

Journal
Zenodo (CERN European Organization for Nuclear Research)
Published
2025-08-08
DOI
https://doi.org/10.5281/zenodo.16777235
Primary Topic
Asthma and respiratory diseases
Type
article
Field-Weighted Citation Impact
0.00
Controls
|||
ALL TIME
JAN
FEB
MAR
APR
MAY
JUN
JUL
AUG
SEP
OCT
article

Localized Embedded Passive Module Layer for High-Performance PCB and Package Designs

Zenodo (CERN European Organization for Nuclear Research)
Asthma and respiratory diseases
article

Localized Embedded Passive Module Layer for High-Performance PCB and Package Designs

article en

Abstract

This proposal introduces a Localized Embedded Passive ModuleLayer (LEPML) concept, integrating capacitors, resistors, andoptionally inductors directly into targeted zones of a PCB or packagesubstrate.

Zenodo (CERN European Organization for Nuclear Research)
Industry, innovation and infrastructure
Openalex Percentile: Top 45%
Asthma and respiratory diseases
DOIOpen Access PDFOpenAlex
AI Navigator

Ask Laika to Summarize, Analyze, and Connect papers live on the map.

Summarize Papers & Methodologies

Extract key findings, datasets, and comparative methods across publications.

Benchmark Rankings & Visual Analytics

Rank top research institutions, authors, funders, topics, and journals by Field-Weighted Citation Impact (FWCI) and paper volume with instant charts.

Connect Distant Disciplines

Bridge topological clusters on the map to find hidden collaborative intersections.

Localized Embedded Passive Module Layer for High-Performance PCB and Package Designs · Zenodo (CERN European Organization for Nuclear Research) (2025) | TGRS Research Map | TGRS