Performance Evaluation of the FASTPIX Silicon Pixel SensorTechnology Demonstrator for High-PrecisionTracking and Timing

The advancement of particle physics through current and future collider facilities pushes theboundaries of technology in HEP instrumentation. Experiments at the energy and intensityfrontier focus on high-precision measurements of Standard Model physics and searches forphysics beyond the Standard Model. The physics programs and operational conditions atfuture colliders necessitate sophisticated improvements in all detector subsystems. Detectorsin the inner layers of future experiments face stringent requirements, needing to detect singleionizing particles with small (< 25 𝜇m) pixels, achieving < 3 𝜇m spatial resolution, < 100 pstime resolution, minimal material budget, and extreme radiation tolerance.This dissertation focuses on advancing silicon vertex and tracking detectors for future highenergyphysics collider detectors by demonstrating the performance of the monolithic siliconpixel sensor demonstrator FASTPIX, which was implemented in a modified 180nm CMOSimaging process technology. The sensor features a small collection electrode design on a 25𝜇m-thin sensitive detection layer with small pixels ranging from 8.66 𝜇m to 20 𝜇m pitch. Alarge parameter space of 32 mini matrices with 68 pixels each assesses the performance impactof manufacturing-process modifications and sensor-design variations previously optimizedin simulations. The sensor design includes hexagonal pixels with capacitances of a fewfemto-farads and large signal-to-noise ratios, enabling high detection efficiency and precisetiming.The detector performance is characterized in laboratory and test beam measurements withassociate developments of hardware and software for the employed test systems. Calibrationmeasurement conclude in a nominal threshold of 60 e – 160 e with ≤15 e front-end noiseand <10 Hz total noise rate across all matrices. Spatial resolutions down to 1 𝜇m for thesmallest-pitch matrices, a timing precision of 100 ps – 150 ps for largest-pitch matrices aswell as hit detection efficiencies >99% are observed in test-beam for samples with processmodifications for improved charge collection.The FASTPIX results match or surpass most analog performance requirements for futurepixel detectors. A larger pixel-matrix size and the integration of full front-end and readoutfunctionality can be envisaged for future HEP applications, taking advantage of advancementsin smaller feature-size CMOS processes.

Publication Details

Journal
DESY Publication Database (PUBDB) (Deutsches Elektronen-Synchrotron)
Published
2025-03-17
DOI
https://doi.org/10.3204/pubdb-2025-01037
Primary Topic
Diatoms and Algae Research
Type
article
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article

Performance Evaluation of the FASTPIX Silicon Pixel SensorTechnology Demonstrator for High-PrecisionTracking and Timing

DESY Publication Database (PUBDB) (Deutsches Elektronen-Synchrotron)
Diatoms and Algae Research
article

Performance Evaluation of the FASTPIX Silicon Pixel SensorTechnology Demonstrator for High-PrecisionTracking and Timing

article en

Abstract

The advancement of particle physics through current and future collider facilities pushes theboundaries of technology in HEP instrumentation. Experiments at the energy and intensityfrontier focus on high-precision measurements of Standard Model physics and searches forphysics beyond the Standard Model. The physics programs and operational conditions atfuture colliders necessitate sophisticated improvements in all detector subsystems. Detectorsin the inner layers of future experiments face stringent requirements, needing to detect singleionizing particles with small (< 25 𝜇m) pixels, achieving < 3 𝜇m spatial resolution, < 100 pstime resolution, minimal material budget, and extreme radiation tolerance.This dissertation focuses on advancing silicon vertex and tracking detectors for future highenergyphysics collider detectors by demonstrating the performance of the monolithic siliconpixel sensor demonstrator FASTPIX, which was implemented in a modified 180nm CMOSimaging process technology. The sensor features a small collection electrode design on a 25𝜇m-thin sensitive detection layer with small pixels ranging from 8.66 𝜇m to 20 𝜇m pitch. Alarge parameter space of 32 mini matrices with 68 pixels each assesses the performance impactof manufacturing-process modifications and sensor-design variations previously optimizedin simulations. The sensor design includes hexagonal pixels with capacitances of a fewfemto-farads and large signal-to-noise ratios, enabling high detection efficiency and precisetiming.The detector performance is characterized in laboratory and test beam measurements withassociate developments of hardware and software for the employed test systems. Calibrationmeasurement conclude in a nominal threshold of 60 e – 160 e with ≤15 e front-end noiseand <10 Hz total noise rate across all matrices. Spatial resolutions down to 1 𝜇m for thesmallest-pitch matrices, a timing precision of 100 ps – 150 ps for largest-pitch matrices aswell as hit detection efficiencies >99% are observed in test-beam for samples with processmodifications for improved charge collection.The FASTPIX results match or surpass most analog performance requirements for futurepixel detectors. A larger pixel-matrix size and the integration of full front-end and readoutfunctionality can be envisaged for future HEP applications, taking advantage of advancementsin smaller feature-size CMOS processes.

DESY Publication Database (PUBDB) (Deutsches Elektronen-Synchrotron)
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Diatoms and Algae Research
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