Process Optimization of Additively Manufactured Conformal Temperature and Humidity Sensor for High-Temperature Applications

Additive Manufacturing (AM) and Printed Electronics (PE) have recently seen widespread implementation in numerous technological applications. The shift towards manufacturing AM PE is largely due to the numerous benefits that AM offers compared to traditional manufacturing. Some of these benefits include the ability to rapidly prototype and the reduction of waste material compared to traditional manufacturing methods, and the ability to realize conformal circuits onto existing structures and substrates with varying form factors. In this work, an AM analog temperature and humidity sensor for high temperature applications was designed and printed using a multi-axis tabletop nScrypt printer. Electrical, mechanical, and statistical testing was performed on the circuits to assess the performance and uniformity of the printed circuits.

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Publication Details

Journal
Journal of Microelectronics and Electronic Packaging
Published
2025-03-15
DOI
https://doi.org/10.4071/001c.133286
Citations
1
Primary Topic
Nanomaterials and Printing Technologies
Type
article
Field-Weighted Citation Impact
0.73
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article

Process Optimization of Additively Manufactured Conformal Temperature and Humidity Sensor for High-Temperature Applications

1 citations
Journal of Microelectronics and Electronic Packaging
Nanomaterials and Printing Technologies
0.73
article

Process Optimization of Additively Manufactured Conformal Temperature and Humidity Sensor for High-Temperature Applications

article en
1 citations

Abstract

Additive Manufacturing (AM) and Printed Electronics (PE) have recently seen widespread implementation in numerous technological applications. The shift towards manufacturing AM PE is largely due to the numerous benefits that AM offers compared to traditional manufacturing. Some of these benefits include the ability to rapidly prototype and the reduction of waste material compared to traditional manufacturing methods, and the ability to realize conformal circuits onto existing structures and substrates with varying form factors. In this work, an AM analog temperature and humidity sensor for high temperature applications was designed and printed using a multi-axis tabletop nScrypt printer. Electrical, mechanical, and statistical testing was performed on the circuits to assess the performance and uniformity of the printed circuits.

Journal of Microelectronics and Electronic PackagingVol. 22(1)
University of Massachusetts Lowell (US), Eaton (United States) (US)
Industry, innovation and infrastructure
Openalex Percentile: Top 21%
Nanomaterials and Printing Technologies
0.73
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Process Optimization of Additively Manufactured Conformal Temperature and Humidity Sensor for High-Temperature Applications · Journal of Microelectronics and Electronic Packaging (2025) | TGRS Research Map | TGRS