Flexible Phase Change\nComposites with Excellent Thermal\nEnergy Storage for the Thermal Management of Electronic Devices

Phase change materials (PCMs) are used in the field of\nthermal\nmanagement because of their ability to absorb and release thermal\nenergy through latent heat. However, the rigidity and leakage issues\nof PCMs limit their application in thermal management of electronic\ndevices. In this paper, we prepared flexible phase change composites\nwith excellent thermal management capabilities by mixing phase change\nmicroparticles with addition-cure liquid silicone rubber (ALSR). The\nprepared flexible phase change composites have superior mechanical\nproperties, thermal cycling capacity, and temperature response rate,\nand the enthalpy can reach 156.1 J/g with a thermal conductivity of\n0.84 W·m<sup>–1</sup>·K<sup>–1</sup>. The\ncomposites avoid the rapid warming by the solid–liquid transition\nof the PCMs, which can be applied to heat dissipation of laptop. To\nsum up, the prepared flexible phase change composites have excellent\nthermal properties and broad application prospects in the area of\nthermal management of electronic devices.