Investigation of Wafer-Level Electromagnetic Heating of Metallic Frames at Radio Frequencies

The research provides concise insights into the thermal effects induced by standing waves. Through a combination of numerical FE simulations and experimental validations, the study comprehensively analyzes the distribution of EM fields, standing wave patterns, and resulting temperature profiles within the metallic frames. These findings offer crucial insights a lead to practical implications and limitations of the heating phenomena of several metallic structures at wafer-level, facilitating advancements in MEMS packaging processes. Further research regarding the coil, generator and process parameter optimization will be based on the presented results.