Design of an inductive sinter module for power packaging

In this work, the thermal behavior of a DBC substrate with a multi-die array using an inductively generated temperature input is investigated. Through a combination of iterative modeling and numerical simulations, the study analyzes the temperature distribution and the resulting temperature profiles within the entire setup. These results provide valuable insights into the practical impact of an alternative temperature generation by induction heating in the field of multi-die attach and power packaging.