Localized Embedded Passive Module Layer for High-Performance PCB and Package Designs

This proposal introduces a Localized Embedded Passive ModuleLayer (LEPML) concept, integrating capacitors, resistors, andoptionally inductors directly into targeted zones of a PCB or packagesubstrate.

Publication Details

Journal
Zenodo (CERN European Organization for Nuclear Research)
Published
2025-08-08
DOI
https://doi.org/10.5281/zenodo.16777234
Primary Topic
Electromagnetic Compatibility and Noise Suppression
Type
article
Field-Weighted Citation Impact
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article

Localized Embedded Passive Module Layer for High-Performance PCB and Package Designs

Zenodo (CERN European Organization for Nuclear Research)
Electromagnetic Compatibility and Noise Suppression
article

Localized Embedded Passive Module Layer for High-Performance PCB and Package Designs

article en

Abstract

This proposal introduces a Localized Embedded Passive ModuleLayer (LEPML) concept, integrating capacitors, resistors, andoptionally inductors directly into targeted zones of a PCB or packagesubstrate.

Zenodo (CERN European Organization for Nuclear Research)
Affordable and clean energy
Openalex Percentile: Top 57%
Electromagnetic Compatibility and Noise Suppression
DOIOpen Access PDFOpenAlex
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Localized Embedded Passive Module Layer for High-Performance PCB and Package Designs · Zenodo (CERN European Organization for Nuclear Research) (2025) | TGRS Research Map | TGRS