POTENTIAL APPLICATIONS OF ELECTROSPUN CHITOSAN AS MAIN COMPONENT IN DEVELOPING HYDROPHOBIC LAYERS FOR PACKAGING MATERIALS

K. Jansons, D. Harusova, M. Kovarova, L. Lovecka, U. Milbreta, L. Andze, I. Filipova, D. Hausner, POTENTIAL APPLICATIONS OF ELECTROSPUN CHITOSAN AS MAIN COMPONENT IN DEVELOPING HYDROPHOBIC LAYERS FOR PACKAGING MATERIALS, Baltic Polymer Symposium, 22nd International Scientific Conference, September 17-19, 2024, Birštonas, Lithuania

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Publication Details

Journal
Zenodo (CERN European Organization for Nuclear Research)
Published
2024-10-25
DOI
https://doi.org/10.5281/zenodo.13992015
Primary Topic
Polymer composites and self-healing
Type
article
Field-Weighted Citation Impact
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article

POTENTIAL APPLICATIONS OF ELECTROSPUN CHITOSAN AS MAIN COMPONENT IN DEVELOPING HYDROPHOBIC LAYERS FOR PACKAGING MATERIALS

Zenodo (CERN European Organization for Nuclear Research)
Polymer composites and self-healing
article

POTENTIAL APPLICATIONS OF ELECTROSPUN CHITOSAN AS MAIN COMPONENT IN DEVELOPING HYDROPHOBIC LAYERS FOR PACKAGING MATERIALS

article en

Abstract

K. Jansons, D. Harusova, M. Kovarova, L. Lovecka, U. Milbreta, L. Andze, I. Filipova, D. Hausner, POTENTIAL APPLICATIONS OF ELECTROSPUN CHITOSAN AS MAIN COMPONENT IN DEVELOPING HYDROPHOBIC LAYERS FOR PACKAGING MATERIALS, Baltic Polymer Symposium, 22nd International Scientific Conference, September 17-19, 2024, Birštonas, Lithuania

Zenodo (CERN European Organization for Nuclear Research)
Tomas Bata University in Zlín (CZ), Latvian State Institute of Wood Chemistry (LV), Plastmetal Engineering (Czechia) (CZ)
Industry, innovation and infrastructure
Openalex Percentile: Top 75%
Polymer composites and self-healing
DOIOpen Access PDFOpenAlex
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