η<sup>6</sup> Organometallic Functionalization\nof Hexagonal Boron Nitride: Implications for Multifunctional Molecular\nand Nanoscale Interfaces on Electronic Applications

Hexagonal boron nitride (h-BN), renowned\nfor its formidable\nattributestensile\nstrength (∼100 GPa), wide bandgap (∼6 eV), high thermal\nconductivity (227–280 W m<sup>–1</sup> K<sup>–1</sup>), and chemical stabilityposes a challenge in functionalization\ndue to its electronegativity variance between boron and nitrogen.\nIn a breakthrough, we present unprecedented organometallic functionalization\nvia chromium carbonyl vapor exposure. This approach forms a pristine\nη<sup>6</sup> bond that preserves lattice planarity and interconnectivity\nbetween B- and <i>N</i>-centers, with the metal engaging\neach h-BN ring. Computational analysis validates spontaneous surface\nreaction (Δ<i>G</i> = −35.50 kcal/mol). Further,\ncarbonyl groups seed silver nanoparticle growth, culminating in a\nconductive layer atop h-BN. This nondestructive, chemically versatile\nfunctionalization introduces a significant advancement in a multifunctional\nnanoscale interface, leveraging h-BN’s thermal and structural\nproperties for 2D FET electronic devices and sensing applications.

Publication Details

Journal
Figshare
Published
2024-12-30
DOI
https://doi.org/10.1021/acsanm.4c05480.s001
Primary Topic
Thermal properties of materials
Type
article
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article

η6 Organometallic Functionalization\nof Hexagonal Boron Nitride: Implications for Multifunctional Molecular\nand Nanoscale Interfaces on Electronic Applications

Figshare
Thermal properties of materials
article

η6 Organometallic Functionalization\nof Hexagonal Boron Nitride: Implications for Multifunctional Molecular\nand Nanoscale Interfaces on Electronic Applications

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Abstract

Hexagonal boron nitride (h-BN), renowned\nfor its formidable\nattributestensile\nstrength (∼100 GPa), wide bandgap (∼6 eV), high thermal\nconductivity (227–280 W m<sup>–1</sup> K<sup>–1</sup>), and chemical stabilityposes a challenge in functionalization\ndue to its electronegativity variance between boron and nitrogen.\nIn a breakthrough, we present unprecedented organometallic functionalization\nvia chromium carbonyl vapor exposure. This approach forms a pristine\nη<sup>6</sup> bond that preserves lattice planarity and interconnectivity\nbetween B- and <i>N</i>-centers, with the metal engaging\neach h-BN ring. Computational analysis validates spontaneous surface\nreaction (Δ<i>G</i> = −35.50 kcal/mol). Further,\ncarbonyl groups seed silver nanoparticle growth, culminating in a\nconductive layer atop h-BN. This nondestructive, chemically versatile\nfunctionalization introduces a significant advancement in a multifunctional\nnanoscale interface, leveraging h-BN’s thermal and structural\nproperties for 2D FET electronic devices and sensing applications.

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Openalex Percentile: Top 81%
Thermal properties of materials
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η<sup>6</sup> Organometallic Functionalization\nof Hexagonal Boron Nitride: Implications for Multifunctional Molecular\nand Nanoscale Interfaces on Electronic Applications · Figshare (2024) | TGRS Research Map | TGRS