Pattern Transfer\nfor van der Waals Integration

Atomically thin two-dimensional materials are promising\ncandidates\nfor designing functional electronic and optical devices through van\nder Waals integration. However, the route toward advanced devices\ntypically involves transferring all prefabricated source materials\nonto target substrates, with significant reliance on post-transfer\nmasking and etching operations to remove undesirable components. The\nexisting transfer technologies are based on spin-coated polymeric\ncarriers lacking controllable geometry, thereby limiting their ability\nto selectively transfer only the designated components of the source\nmaterials. Here, we introduce a pattern transfer technology for picking\nout the desired components from source materials on demand by rapidly\npatterning scalable polymeric transfer carriers into the required\nshapes and sizes. Patterned carriers provide the advantages of twist-angle\ncontrollability and one-step preparation of ready-to-transfer electrodes,\nenabling the formation of supermoiré homostructures and van\nder Waals electrical contacts. These capabilities of the pattern transfer\ntechnology offer great potential for the design and versatile integration\nof multifunctional van der Waals devices and drive forward the industrial\napplication of two-dimensional materials.