Deep learning-driven conversion of scanning superlens microscopy to high depth-of-field SEM-like imaging

Scanning electron microscopy (SEM) enables nanoscale imaging but requires vacuum environments and coating samples with conductive films. We present a deep learning approach to transform optical super-resolution (OSR) microscopy images into high-resolution images resembling SEM, specifically optimized for chip samples. Utilizing our custom-designed scanning superlens microscopy (SSUM) system, we acquire OSR images with a resolution down to ~80 nm without the need for coatings or vacuum conditions. Notably, the SSUM system achieves an effective depth-of-field (DoF) of approximately 2 μm through Z-stack scanning, enabling clear visualization of multilayer chip structures across a larger axial range than conventional optical imaging. Our algorithm further enhances the nanoscale microstructures observed with the SSUM platform, significantly improving the visibility of structures that are otherwise less distinct. A cycle-consistent generative adversarial network (CycleGAN) model is trained on paired OSR and SEM images to learn the mapping between these imaging modalities. The model is then applied to unseen OSR test images from silicon wafer samples. Quantitative analysis shows that the reconstructed images achieve a mean peak signal-to-noise ratio (PSNR) 1.64 dB higher than the input OSR images. Qualitative assessment further demonstrates the model's ability to generate results with high structural detail, specifically in chip-level applications. This technique overcomes key SEM constraints while preserving nanoscale resolution, offering the potential for advanced chip manufacturing and inspection tasks where traditional SEM requirements pose challenges.

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Publication Details

Journal
Microsystems & Nanoengineering
Published
2025-12-19
DOI
https://doi.org/10.1038/s41378-025-01060-9
Primary Topic
Advanced Electron Microscopy Techniques and Applications
Type
article
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article

Deep learning-driven conversion of scanning superlens microscopy to high depth-of-field SEM-like imaging

Dapeng Wu, Xiaoduo Wang, Hao Luo, Qingjiu Chen et al.
Microsystems & Nanoengineering
Advanced Electron Microscopy Techniques and Applications
article

Deep learning-driven conversion of scanning superlens microscopy to high depth-of-field SEM-like imaging

Dapeng Wu, Xiaoduo Wang, Hao Luo, Qingjiu Chen, Wen J. Li, Lianqing Liu, Hui Sun, Guanglie Zhang, Meng Chen, Feifei Wang, Haibo Yu, Jianping Wang
article en

Abstract

Scanning electron microscopy (SEM) enables nanoscale imaging but requires vacuum environments and coating samples with conductive films. We present a deep learning approach to transform optical super-resolution (OSR) microscopy images into high-resolution images resembling SEM, specifically optimized for chip samples. Utilizing our custom-designed scanning superlens microscopy (SSUM) system, we acquire OSR images with a resolution down to ~80 nm without the need for coatings or vacuum conditions. Notably, the SSUM system achieves an effective depth-of-field (DoF) of approximately 2 μm through Z-stack scanning, enabling clear visualization of multilayer chip structures across a larger axial range than conventional optical imaging. Our algorithm further enhances the nanoscale microstructures observed with the SSUM platform, significantly improving the visibility of structures that are otherwise less distinct. A cycle-consistent generative adversarial network (CycleGAN) model is trained on paired OSR and SEM images to learn the mapping between these imaging modalities. The model is then applied to unseen OSR test images from silicon wafer samples. Quantitative analysis shows that the reconstructed images achieve a mean peak signal-to-noise ratio (PSNR) 1.64 dB higher than the input OSR images. Qualitative assessment further demonstrates the model's ability to generate results with high structural detail, specifically in chip-level applications. This technique overcomes key SEM constraints while preserving nanoscale resolution, offering the potential for advanced chip manufacturing and inspection tasks where traditional SEM requirements pose challenges.

Microsystems & NanoengineeringVol. 11(1)
Shenyang Institute of Automation (CN), City University of Hong Kong (HK), Chinese Academy of Sciences (CN), City University of Hong Kong, Shenzhen Research Institute (CN), University of Hong Kong (HK)
Openalex Percentile: Top 79%
Advanced Electron Microscopy Techniques and Applications
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