Research on Dynamic Characteristics of Air Static Pressure Spindle for Silicon Wafer Grinding Machine

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Publication Details

Journal
Journal of Mechanical Engineering
Published
2025-01-01
DOI
https://doi.org/10.3901/jme.2025.05.108
Citations
1
Primary Topic
Advanced Surface Polishing Techniques
Type
article
Field-Weighted Citation Impact
0.67
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article

Research on Dynamic Characteristics of Air Static Pressure Spindle for Silicon Wafer Grinding Machine

1 citations
Journal of Mechanical Engineering
Advanced Surface Polishing Techniques
0.67
article

Research on Dynamic Characteristics of Air Static Pressure Spindle for Silicon Wafer Grinding Machine

article en
1 citations

Abstract

No abstract available for this paper.
Journal of Mechanical EngineeringVol. 61(5)
Dalian University of Technology (CN)
Openalex Percentile: Top 24%
Advanced Surface Polishing Techniques
0.67
DOIOpen Access PDFOpenAlex
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Research on Dynamic Characteristics of Air Static Pressure Spindle for Silicon Wafer Grinding Machine · Journal of Mechanical Engineering (2025) | TGRS Research Map | TGRS