Optimization of Residual Stress in AlN-Cu Brazing Joint Based on Heterogeneous Interlayer

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Publication Details

Journal
Journal of Mechanical Engineering
Published
2025-01-01
DOI
https://doi.org/10.3901/jme.2025.08.098
Primary Topic
Silicon Carbide Semiconductor Technologies
Type
article
Field-Weighted Citation Impact
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article

Optimization of Residual Stress in AlN-Cu Brazing Joint Based on Heterogeneous Interlayer

Journal of Mechanical Engineering
Silicon Carbide Semiconductor Technologies
article

Optimization of Residual Stress in AlN-Cu Brazing Joint Based on Heterogeneous Interlayer

article en

Abstract

No abstract available for this paper.
Journal of Mechanical EngineeringVol. 61(8)
Zhejiang University of Technology (CN)
Openalex Percentile: Top 58%
Silicon Carbide Semiconductor Technologies
DOIOpen Access PDFOpenAlex
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Optimization of Residual Stress in AlN-Cu Brazing Joint Based on Heterogeneous Interlayer · Journal of Mechanical Engineering (2025) | TGRS Research Map | TGRS