Defect Inspection Method of Flip Chip Based on VMD-resonance Band-energy Entropy

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Publication Details

Journal
Journal of Mechanical Engineering
Published
2025-01-01
DOI
https://doi.org/10.3901/jme.2025.10.250
Primary Topic
Ultrasonics and Acoustic Wave Propagation
Type
article
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article

Defect Inspection Method of Flip Chip Based on VMD-resonance Band-energy Entropy

Journal of Mechanical Engineering
Ultrasonics and Acoustic Wave Propagation
article

Defect Inspection Method of Flip Chip Based on VMD-resonance Band-energy Entropy

article en

Abstract

No abstract available for this paper.
Journal of Mechanical EngineeringVol. 61(10)
Jiangnan University (CN)
Openalex Percentile: Top 55%
Ultrasonics and Acoustic Wave Propagation
DOIOpen Access PDFOpenAlex
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Defect Inspection Method of Flip Chip Based on VMD-resonance Band-energy Entropy · Journal of Mechanical Engineering (2025) | TGRS Research Map | TGRS