Reliability life study of printed circuit boards
As a component support and signal transmission medium for high-density and miniaturised printed circuit boards (PCBs), their reliability has gained increasing importance in high-reliability sectors such as aviation, aerospace, medical, and military applications. They have become the third critical factor influencing overall system reliability, following components and electronic assembly solder joints. This study assesses the performance condition and life expectancy of such circuit board cards through life data analysis of switching signal acquisition boards and by examining their performance degradation process. The findings provide a reference for the replacement or overhaul of circuit board cards during actual operation, while also ensuring the safety and reliability of the electrical equipment.
Authors
- Shuai Xiang (ORCID: https://orcid.org/0000-0002-5417-6445)
- Yiye Sun
- Xingyu Li (ORCID: https://orcid.org/0000-0001-8034-1232)
- Yin Zhang (ORCID: https://orcid.org/0000-0001-7479-3507)
- Jing Yang (ORCID: https://orcid.org/0000-0002-4218-8342)
- Jinying Xiong
- Hu Guo
Institutions
- Wuhan Ship Development & Design Institute (CN)
- Guangzhou Metro Group (China) (CN)
Publication Details
- Journal
- IET conference proceedings.
- Published
- 2025-12-01
- DOI
- https://doi.org/10.1049/icp.2025.3612
- Primary Topic
- Electronic Packaging and Soldering Technologies
- Type
- article
- Field-Weighted Citation Impact
- 0.00