Study on the factors of substrates shedding in T/R module and failure cases analysis

The Transmit/Receive (T/R) module, as a fundamental constituent of active phased array radar systems, plays a decisive role in determining both radar performance and operational longevity. Achieving high reliability within the T/R module requires maintaining superior quality across all interconnect interfaces. As electronic integration density continues to increase, research attention has increasingly shifted toward chip stacking and attachment technologies, often overlooking the integrity of the solder joint between chip-mounted substrates and the module shell. This oversight has led to multiple failure instances attributed to substrate detachment, which in some cases has significantly impaired radar functionality. This study systematically examines the underlying causes of substrate detachment by analysing factors such as panel structural design, coating thickness, substrate defects, solder material selection, and welding process parameters. Documented failure cases are presented to illustrate the practical implications of these issues. Based on the analysis, targeted strategies are proposed to improve the quality and reliability of the interconnection between the substrate and the module shell, thereby enhancing the overall robustness of the T/R module.