Research and application of reliability improvement methods for the electronic assembly process

This paper addresses the electronic assembly process and proposes solutions to improve process reliability through practical case studies. During the circuit board trial production, on-site diagnostics and comprehensive product analysis were conducted to identify vulnerabilities affecting reliability. By implementing manufacturability design improvements, optimizing process materials, and refining process parameters, reliability risks associated with the electronic assembly process were systematically mitigated. These measures collectively reinforced the assembly process and enhanced the overall product reliability.